Additive manufacturing, commonly known as 3D printing, is transforming the way products are designed, produced, and distributed. As this technology advances, the need for specialised packaging ...

Ottawa, Sept. 29, 2025 (GLOBE NEWSWIRE) -- The global 3D printed packaging market size was recorded at USD 1.67 billion in 2025 and is forecast to increase to USD 2.71 billion in 2034, as per findings ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

Dublin, May 26, 2023 (GLOBE NEWSWIRE) -- The "Global 3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV, 2.5D), Application (Logic, Memory, ...

The company held its Samsung Foundry Forum 2024 in San Jose, California, and teased its new 3D packaging technology for HBM chips in a public event, with current-gen HBM memory chips packaged mostly ...

What’s new: CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design. The research will focus on assembly of smaller ...

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...

When it comes to making though-silicon vias, there are no clear lines of delineation about the roles of design houses, fab facilities, and packaging houses. Yet all of these entities face a host of ...