TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced that the company’s research papers have been accepted for presentation at IEEE International Electron ...

Three-dimensional (3D) memory integration marks a significant advancement in semiconductor technology, enabling higher device densities and enhanced performance for modern applications. However, the ...

Companies Preview 10th Generation 3D Flash Memory Technology Setting A New Benchmark for Performance, Power Efficiency and Bit Density Unveiled at ISSCC 2025, the new 3D flash memory innovation, ...

CEO Andy Hsu will introduce NEO Semiconductor's 3D X-AI™, a game-changing 3D memory with AI processing that combines data storage and data processing in a single chip, accelerating neural performance ...

Showcase the technology of highly stackable oxide-semiconductor channel transistors Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable ...

Seoul National University College of Engineering announced that a research team has developed a new hardware security technology based on commercially available 3D NAND flash memory (V-NAND flash ...

One of the most fundamental problems in modern silicon is known as the processor-memory performance gap. The term, which has been used for decades, refers to the well-known tendency for CPUs to ...

Speaking at the American Chemical Society, James Tour of Rice University has apparently demonstrated non-volatile 3D memory chips that are transparent, flexible enough to be folded like paper, and ...

Flash memory chip maker SanDisk has teamed up with Toshiba to jointly develop and manufacture re-writeable 3D memory, SanDisk revealed in a filing to U.S. stock market regulators on Tuesday. Both ...

Developing economies do not have to invest billions of dollars in state-of-the-art fabs to get into the semiconductor industry, according to Sadeg Faris, chairman and chief executive officer of Reveo ...