Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, ...
Instead of semiconductors with parts laid out on a flat surface, they developed a '3D chip' in which layers of parts are stacked vertically. This has resulted in significant improvements, such as a ...
Lam Research is poised for long-term growth due to the increasing demand for 3D NAND, DRAM, and logic chips driven by AI adoption. Regardless of concerns over potential revenue loss from China, Lam's ...
Researchers at Stanford, MIT, and other universities unveiled a new, monolithic 3D processor that could help solve one of the biggest problems facing chipmakers: the processor-memory performance gap.
Siemens’ Xpedition Substrate Integrator provides co-design prototyping and planning of 2.5/3D chips.
Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...
Morning Overview on MSN
This new 3D chip could smash AI’s biggest bottleneck
Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...
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