The company held its Samsung Foundry Forum 2024 in San Jose, California, and teased its new 3D packaging technology for HBM chips in a public event, with current-gen HBM memory chips packaged mostly ...

Lam Research LRCX is putting more focus on advanced packaging as demand for AI chips grows. In the fourth quarter of fiscal 2025, management noted that demand for AI chips is pushing the industry ...

SAN FRANCISCO, June 27, 2024 /PRNewswire/ -- Dr. Larry Zu, Founder and CEO of Sarcina Technology, the Application Specific Advanced Packaging (ASAP) Design Service and Production leader, predicted ...

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures "VECTOR TEOS 3D deposits the ...

First of-its-kind center will offer advanced packaging and test capabilities in New York for U.S.-made essential chips used in AI, automotive, aerospace and defense, and other applications MALTA, N.Y.

Bruker Corporation BRKR recently announced the shipment and installation of its 15th InSight WLI 3D optical metrology system for a leading semiconductor manufacturer. The installation is part of a ...

GlobalFoundries (GF) has announced plans to build an Advanced Packaging and Photonics Center in the state of New York, USA. Describing the center as “the first of its kind,” the company said the new ...

GlobalFoundries plans a new advanced packaging center in New York for U.S.-made semiconductor chips, supported by state and federal funding. GlobalFoundries has announced plans to establish a new ...

There's better, cost-effective path to 2.5D packaging landscape SAN FRANCISCO, June 27, 2024 /PRNewswire/ -- Dr. Larry Zu, Founder and CEO of Sarcina Technology, the Application Specific Advanced ...