“They are not really focusing on the future. They are continuing to obsess about the past and the good work that we have done. Unlike where our Democratic colleagues are, we're really looking at the ...

Advanced semiconductor packaging requirements for higher and faster performance in a thinner and smaller form factor continues to grow for mobile, network and consumer devices. While the increase in ...

Rep. Robyn Vining (D-Wauwatosa), Rep. Dave Considine (D-Baraboo), Rep. Supreme Moore Omokunde (D-Milwaukee) and Rep. Lori A. Palmeri (D-Oshkosh) reintroduced the “Mental Healthcare is Healthcare” ...

SACRAMENTO — Two approaches are gaining traction as California confronts the issue of retail theft, which was propelled to the top of the state’s political agenda this year by viral videos of ...

Chip design companies and package assembly houses have no unified signoff verification process to ensure that an IC package meets manufacturability and performance requirements. Packages need a ...

This application note provides guidelines for the handling and assembly of Freescale’s Heat Sink Small Outline Package (HSOP) and Power Quad Flat Package (PQFP) during printed circuit board (PCB) ...

This application note provides the PCB design and SMT assembly guidelines for Maxim Integrated’s leaded packages (SOIC, TSSOP, QSOP, QFP, SC70, SOP, SOT, etc.). Leaded packages are surface-mount ...

The New York Senate's Democratic supermajority passed seven legislative bills on Tuesday that it says are meant to enhance judicial accountability. Portions of the bill package was delivered to the ...