In October 2023, 123 years after Toppan Printing was founded in Tokyo in 1900, the group was reorganized into a holding company structure with Toppan Inc. as the core operating company. Based on a ...

Bolstering high-end substrate production capabilities to meet semiconductor needs for AI and data centers December 17, 2025-- TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary ...

LG Innotek recently unveiled the latest FC-BGA for the first time at the 'CES 2023'. LG Innotek's FC-BGA is highly integrated, multi layered and large scaled. Also, it has fine patterning and a lot of ...

SEOUL, South Korea, April 30, 2025 /PRNewswire/ -- LG unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the ...

Jeong Cheol-dong, CEO and president of LG Innotek, vowed that his company will become a global leader in a next-generation semiconductor packaging substrate known as flip chip ball grid array (FC-BGA) ...

Samsung Electro-Mechanics and LG Innotek are focusing on the high-value semiconductor substrate "flip chip ball grid array" (FC-BGA) to diversify their business portfolios. But as Taiwan's TSMC, the ...

Revenues generated at Unimicron Technology's new flip-chip ball-grid array (FC BGA) substrate plant will reach NT$500 million (US$15.3 million) per month in 2016, up from about NT$350 million in ...

The global advanced IC substrate market is poised for significant growth, according to recent industry reports. Global Information, Inc. (GII) projects the market to reach US$18.11 billion in 2024 and ...

LG has unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the media for the first time and announced it on ...