An organic low-k dielectric material has been found capable of forming bonds to copper interconnects that are five times stronger than the tantalum compounds semiconductor makers use today. Dubbed ...
It's been 20 years since IBM first introduced copper interconnects in CMOS processing, sparking a minor revolution in the process. Within a handful of years, both Intel and AMD had made the jump as ...
Cooper Interconnect, a leading manufacturer of interconnect solutions, today announced that Space Exploration Technologies (SpaceX) utilized Cooper Interconnect non-explosive actuators on the Dragon ...
Aveni, a developer and manufacturer of wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, has announced it has obtained results that support the ...
Thermal conductivity plays a critical role within semiconductor technology; to meet the needs required for this ever-evolving industry, novel materials that improve thermal conductivity are paramount.
Part one of this forecast looked at evolving transistor architectures and lithography platforms. This report examines revolutions in interconnects and packaging. When it comes to device interconnects, ...
Electromigration (EM) remains a critical reliability challenge in modern microelectronic systems, particularly as device miniaturisation and increased current densities intensify the phenomenon. In ...
The unique properties of thin layers of graphite – known as graphene – make the material attractive for a wide range of potential electronic devices. Researchers have now experimentally demonstrated ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Spectra7 Microsystems Inc. (TSX:SEV) (“Spectra7” or the “Company”), a leading provider of high-performance analog semiconductor products for broadband connectivity ...
Chipmakers continue to make advancements with transistor technologies at the latest process nodes, but the interconnects within these structures are struggling to keep pace. The chip industry is ...
It's been 20 years since IBM first introduced copper interconnects in CMOS processing, sparking a minor revolution in the process. Within a handful of years, both Intel and AMD had made the jump as ...