The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...
Flip chip packaging connects chips directly to boards using solder bumps, skipping the old wire bonding method for a more ...
CHANDLER, Ariz., Oct. 17, 2024 (GLOBE NEWSWIRE) -- Satisfying mission assurance requirements for the most critical space programs, Microchip Technology’s (Nasdaq: MCHP) Radiation-Tolerant (RT) RTG4™ ...
A technical paper titled “Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin” was published by researchers at Delft University of Technology and NXP ...
Karl J. Puttlitz Sr. and Paul A. Totta have won the 2008 IEEE Components, Packaging and Manufacturing Technology Award. They are being recognized for their pioneering role in the establishment of flip ...
Geneva, October 09,2008 – By combining EMI filtering and ESD protection for 10 high-speed signal lines in a 1.98 x 2.08 mm flip-chip package, the EMIF10-LCD03F3 from STMicroelectronics (NYSE: STM), ...
The SP1012 series TVS diode array is the most densely designed ESD protection device on the market today. It packs five ESD diodes in a 0402-size (0.94 x 0.61-mm) flip-chip package that would normally ...
Not so long ago, defense and aerospace applications were the traditional drivers of advances in electronic packaging technologies, or "the way electronic systems are assembled." At the time, cost was ...
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