Micro-electro-mechanical systems have been available for years, and have been successful in selected high-volume applications. But MEMS design is not as organized as it could be. MEMS design typically ...

3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...

Taiwan Semiconductor Manufacturing Co. (TSMC) today released what it believes is the first manufacturability-focused IC design flow that is silicon-proven in its 0.25-micron and 0.18-micron ...

HSINCHU, Taiwan & SAN JOSE, Calif.--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc.

TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog post. The latest ...

Skilled engineers remain the driving force for innovation in chips. But it’s no secret that electronic design automation (EDA) companies are folding AI into more of their offerings to speed up design ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...