Semiconductor Engineering

Design Flow Challenged By 3D-IC Process, Thermal Variation

3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...
Semiconductor Engineering

Boost High-Performance IC Design Flows With Early Interactive Symmetry Checking

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...
EDN

TSMC Unveils IC Design Flow For 0.25-, 0.18-Micron Processes

Taiwan Semiconductor Manufacturing Co. (TSMC) today released what it believes is the first manufacturability-focused IC design flow that is silicon-proven in its 0.25-micron and 0.18-micron ...
EDN

Analog design flow certified for UMC’s 22ULP/ULL process

Cadence Design Systems has optimized its analog and mixed-signal IC design flow for UMC’s 22ULP/ULL process technologies targeted at 5G, Internet of Things (IoT), and display applications. The ...
Nasdaq

Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack

Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA ...
Business Wire

SpringSoft Completes OpenAccess-Compatible IC Layout Flow with Enhancements to Laker ADP Design Entry System

HSINCHU, Taiwan-- (BUSINESS WIRE)-- SpringSoft, Inc., a global supplier of specialized IC design software, today announced the availability of the latest version of its Laker™ Advanced Design Platform ...