A single-chip CMOS modem, the NCN5193 from ON Semiconductor, uses phase-continuous frequency shift keying to deliver a half-duplex data rate of 1200 bps for use in HART (highway addressable remote ...
Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...
Dublin, May 26, 2023 (GLOBE NEWSWIRE) -- The "Global 3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV, 2.5D), Application (Logic, Memory, ...
Yangtze Memory Technologies (YMTC) is collaborating with local Chinese flash device controller suppliers to market SSDs with its 232-layer NAND chips at relatively low prices, according to sources at ...
The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...
Developing economies do not have to invest billions of dollars in state-of-the-art fabs to get into the semiconductor industry, according to Sadeg Faris, chairman and chief executive officer of Reveo ...
MIT researchers have fabbed an IC by depositing ‘significantly different’ materials in the same layer, a few atoms thick. “The methodology is universal for many kinds of structures,” says researcher ...
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