It has taken decades of research and development and strong commitment to various industry programs, but the stars are finally aligning for 3D semiconductor systems. No one could have left the 3D & ...

The days of “throwing it over the wall” are over. Heterogeneous integration is ushering in a new era of silicon chip design with collaboration at its core—one that lives or dies on seamless ...

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...

Complex manual steps in aircraft production – such as the assembly of newly developed, weight-reducing thermoplastic integral frames that stiffen the fuselage in the transverse direction – are to be ...