The white paper concludes that one-size-fits-all cleaning approaches are insufficient for advanced semiconductor packaging. Instead, manufacturers must carefully align defluxing chemistry and process ...

Electronic engineers often spend a lot of time on circuitry and components, as they should; after all, that’s their job. Still, there are cases where that aspect of the project is relatively ...

What are the 2 categories of mounting method in IC packaging? Describe these categories and its package types. The final step in IC fabrication is packaging the device in a suitable medium that can ...

Co. plans to invest up to US$300 million in a high-density optical-electrical printed circuit board (PCB) project aimed at ...

Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass ...