Polyimide resins are known for their thermal stability, durability, and resistance to a range of solvents and chemicals. Combined with their excellent dielectric properties, these polymers possess ...

Detailed measurements and analysis of the dielectric properties of polyimides could bolster the development of 6G wireless communication technologies, report scientists from Tokyo Tech and EM Labs, ...

A diamine with a side group of pentafluorophenyl, 5FBODA, was synthesized and copolymerized with HFBAPP and 6FESDA to form a fluorinated polyimide, effectively reducing the dielectric constant and ...

Redistribution layers (RDLs) are used throughout advanced packaging schemes today including fan-out packages, fan-out chip on substrate approaches, fan-out package-on-package, silicon photonics, and 2 ...