Hamamatsu Photonics has developed the HyperGauge thickness measurement system C17319-11, a new device designed to enhance ...
Tech Xplore on MSN
New semiconductor etching process achieves five-fold speed improvement
After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...
A new technical paper titled “Where Do the Electrons Go? Studying Loss Processes in the Electrochemical Charging of Semiconductor Nanomaterials” was published by researchers at Delft University of ...
Research conducted in Brazil at the Center for Development of Functional Materials (CDMF) and the Center for Innovation in New Energies (CINE) has developed a novel approach to the plasma treatment of ...
Within the meticulous and layered journey of manufacturing semiconductor wafers, which could encapsulate anywhere from hundreds to thousands of steps over one to two months, even a minor defect or ...
The main market opportunities in the Semiconductor PVD Equipment sector lie in addressing the complex needs of scaling and material innovations while ensuring resilient and efficient manufacturing.
Semiconductor manufacturing: Next-generation polyamide sheet shortens processing time and cuts costs
This company has developed a negative photo-definable polyimide sheet for glass-core substrates in used to connect chips to ...
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