SANTA CLARA, Calif.–Applied Materials Inc. today announced a new silicon etch chamber for 200- and 300-mm wafer DRAM fabs needing deep-trench etching technology for 100-nm and below process geometries ...
Applied Materials today rolled out its DPS II Centura 300 etch tool, its second-generation 300mm tool featuring a chamber that can be used for either silicon or metal etch, the Santa Clara, ...
As semiconductor technology scales down in size, process integration complexity and defects are increasing in 3D NAND flash, partially due to larger stack deposits and thickness variability between ...
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