Soldering is best done under magnification. Parts become ever smaller and eyes get weaker, so even if you don’t need magnification now, you will. [Makzumi] didn’t want to shell out $400 or more for a ...

When electronic components are mounted onto a printed circuit board, they are subsequently visually inspected to ensure they are mounted correctly. Historically, these boards were photographed with a ...

Previously, a Power Electronics Technology article titled “Inverted Acoustic System Cuts IGBT Failures” (September 2011) examined the use of an acoustic microscope to image heat-blocking defects such ...

In a study, the non-destructive Xradia VersaXRM-500 laboratory X-ray microscope was used to analyze one 45 x 45 mm package for voids within C4 solder bumps. After completing the image acquisition and ...

Failure analysts often use scanning acoustic microscopes to image flip-chip features such as underfill voids, delaminations, and disbonded solder bumps. As designers have decreased the size of IC ...