TAIPEI, Taiwan--(BUSINESS WIRE)--TrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding.

BE Semiconductor is the market leader in the Die Attach semiconductor segment. BESIY has been quite volatile since 2023, torn between investor optimism on the new generation of Chip Bonding and ...

SINGAPORE, Nov. 13, 2024 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company"), in collaboration with ...

Earnings Call Insights: BE Semiconductor Industries N.V. (OTC:BESIY) Q4 2024 Revenue for Q4 2024 was €153.4 million, with a 2% sequential decline and a 3.9% drop year-over-year, due to weaker ...

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...

LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth memory ...

The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid ...

Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional ...

Hanmi Semiconductor has begun mass production of its thermal compression bonder (TCB) for HBM4, targeting the rapidly expanding high bandwidth memory market driven by AI workloads. But its delayed ...

Revenue for Q4 2024 was €153.4 million, with a 2% sequential decline and a 3.9% drop year-over-year, due to weaker mainstream assembly markets and lower demand for hybrid bonding and photonics ...