Plans are being formulated for the rollout of multiple types of gate-all-around FETs and literally dozens of advanced packaging options. The question now is which ones will achieve critical mass, ...

Power management ICs already contain power MOSFETs as integrated elements. This includes switching regulators with integrated FETs, of course, but also includes the driver ICs, which themselves ...

After decades of being considered almost an afterthought, semiconductor packaging is emerging as an integral part of the Moore’s Law road map. Power, heat, manufacturing and impurities like soft ...

Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond-silicon materials, chip interconnects, and packaging technology, among ...