Business Insider

Akoustis Locks Process Flow for Second Wafer Level Package for XBAW Filters

Charlotte, N.C., May 03, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) ...
Semiconductor Engineering

Transistor-Level Performance Evaluation Based On Wafer-Level Process Modeling

Three years ago, I wrote a blog entitled “Linking Virtual Wafer Fabrication Modeling with Device-level TCAD Simulation,” in which I described the seamless connection between the SEMulator3D virtual ...
EDN

Amkor licenses K&S wafer-level packaging for Korean assembly plant

WILLOW GROVE, Pa. — Kulicke & Soffa Industries Inc. today announced it has extended its technology licensing arrangement with Amkor Technology Inc. to include wafer-level chip-scale packaging ...
EDN

Amkor Licenses K&S’ Wafer Level Packaging Technology

Kulicke & Soffa Industries Inc. (K&S) today announced that Amkor Technology Inc. of Chandler, Ariz., will license its wafer level packaging technology from Flip Chip Technologies LLC (FCT) for its ...
Semiconductor Engineering

Solving Fan-Out Wafer-Level Warpage Challenges Using Material Science

Now more than ever we’re finding that semiconductor process engineers are turning to material scientists to help find solutions for their most complex challenges. Currently, they are looking for ways ...
AZOM

Maximize Performance and Optimizes Costs with Plasma Treatment

Nordson MARCH Addresses the Ways Plasma Treatment during Fan-out Wafer and Fan-out Panel-Level Semiconductor Packaging Maximizes Performance and Optimizes Costs In recent years, there has been an ...