Nasdaq

Akoustis Locks Process Flow for First Wafer-Level-Chip-Scale Package (WLCSP) for XBAW Filters

Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...
Business Insider

Akoustis Locks Process Flow for Second Wafer Level Package for XBAW Filters

Charlotte, N.C., May 03, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) ...
EDN

Amkor licenses K&S wafer-level packaging for Korean assembly plant

WILLOW GROVE, Pa. — Kulicke & Soffa Industries Inc. today announced it has extended its technology licensing arrangement with Amkor Technology Inc. to include wafer-level chip-scale packaging ...
AZOM

Maximize Performance and Optimizes Costs with Plasma Treatment

Nordson MARCH Addresses the Ways Plasma Treatment during Fan-out Wafer and Fan-out Panel-Level Semiconductor Packaging Maximizes Performance and Optimizes Costs In recent years, there has been an ...