A dicing saw is a saw that is used to dice, groove, or cut semiconductor wafers by using a high-speed spindle that has been fitted with a diamond blade. A dicing saw is a part of a dicing machine, ...

Modern photolithography machines must deliver extraordinary precision on a repeatable basis, and in high volume production. In response to demands for increased throughput in the semiconductor ...

– SCHMID accompanies production change-over and takes care of downstream processes. The wafers of the future are getting thinner and thinner and already approaching a thickness of 140 µm. The slurry ...

Solar power still costs more than energy gained from burning coal or gas. That fact may put opponents of subsidies up in arms, but it’s great for companies that automate photovoltaic (PV) ...