*Many factors can affect the device thickness. Process optimizations might be necessary. Laser debonding results at 308 nm using BrewerBOND T1107 (2 µm) and BrewerBOND C1301-50 (60 µm) materials, with ...

Dielectric materials are vitally important in the function of microelectronic devices, as these materials electrically isolate conductive components from each other in microcircuits. Capacitance ...

The adhesion of dielectric thin films has presented a major obstacle for interconnect integration and dependability. Issues such as film adhesion failures, reduced dielectric film mechanical integrity ...

NAPERVILLE, Ill. — Tezzaron Semiconductor Corp.–formerly known as Tachyon Semiconductor Corp.–here took a step to enable three-dimensional (3-D) silicon by year's end. The chip-packaging specialist ...