Some industry sectors such as automotive and medical continue to push for higher and higher reliability levels; however, many fabs are having difficulties achieving them. Current inspection regimes ...

SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...

As semiconductor manufacturers aim to produce devices at the 5-nanometer node, the ability to find tiny defects created inadvertently during the fabrication process becomes harder. In addition, there ...

WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced its first shipment of the Company’s Dragonfly ® G3 system with the ...

The electrification of vehicles is fueling demand for silicon carbide power ICs, but it also is creating challenges in finding and identifying defects in those chips. Coinciding with this is a growing ...

Following its acquisition of Candela Instruments, KLA-Tencor (www.kla-tencor.com) has introduced the Candela CS20, an automated wafer inspection system designed to address the defect management ...

Figure 1. Comparison between conventional imaging using an imaging system (left) and “diffractive imaging” (right). In both cases, the sample needs to be illuminated by EUV light. However, the ...

TOKYO, Sept 13, 2021 - (JCN Newswire) - - Showa Denko K.K. (SDK; TSE:4004) has concluded a long-term supply contract with ROHM Co., Ltd. (ROHM), a Japanese semiconductor manufacturer providing highly ...

Semiconductors guarantee high resistance, low cost, and reliability when used in electronic circuits. To manufacture semiconductor devices, multiple photographic and chemical-processing steps are ...