Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...
The high-frequency Center Probe and CSP/MicroBGA test and burn-in sockets are now offered in sizes up to 6.5-mm2 with pitches down to 0.3 mm to enable the testing of smaller components. The sockets ...
Offered in DIP ZIF, PGA ZIF, PLCC ZIF, and SOIC ZIF versions, a line of universal RoHS-compliant ZIF test sockets can be soldered into PCBs or plugged into any socket. Contacts are normally closed to ...
Dublin, March 09, 2022 (GLOBE NEWSWIRE) -- The "Test / Burn-in Sockets - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering. Global Test / Burn-in Sockets ...
Designed for quick and easy testing of single-phase industrial socket wiring, the CP201 includes both 16A and 32A industrial ...