Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC™ solution. The solution provides a fast, predictable pathfinding, planning and ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

Taiwan Semiconductor Manufacturing (NYSE:TSM) operates within this sector as a major contract manufacturer for advanced chips ...

With the dynamic growth and ubiquity of electronic systems globally, software-defined, AI-powered, and silicon-enabled technologies are critical for today’s semiconductor industry, which is projected ...

Higgins projected, "The industry outlook for 2026 has strengthened over the past few months. We expect the core WFE market to grow in the high single to low double digits, reaching the low $120 ...

Scandium is getting harder to source, and U.S. chip and aerospace supply chains are feeling it right now. Some suppliers have ...

Qnity Electronics on Thursday reported strong fourth-quarter results alongside rosy guidance, solidifying its reputation as an under-the-radar beneficiary of the artificial intelligence boom. Revenue ...

Southeast Asia and India will likely emerge as volume-based back-end assembly and test hubs, specializing in select areas of the back-end processes.

Reliability is now a system-level concern that includes everything from materials and packaging to testing with backside power.

Semiconductor Engineering sat down to discuss challenges and solutions for data center build-out and build-up with Gordon ...

TSMC's vast complex outside Phoenix is central to that effort. The 2,000-acre site is slated to host six fabrication plants along with supporting infrastructure. Apple is ...

Artificial intelligence is a structural force reshaping capital flows, business models, and the very frameworks investors use ...