Samsung may be confused about its display this year, but you don't have to be. It needs protection, and these protectors are ...

Abstract: Glass carriers play an important role in today's advanced packaging fields. We describe two major industrial applications: device wafer thinning and fan-out wafer level packaging. In wafer ...

Abstract: Fan-out packaging addresses several challenges with traditional packaging. These include direct assembly to system substrates and boards, while eliminating off-chip solder interconnects with ...

The Glass Packaging Institute (GPI), Arlington, Virginia, has announced a call for submissions for the 2027 Clear Choice Awards, a recognition program honoring glass packaging design in North America.