Abstract: Universal Chiplet Interconnect Express (UCIe) is an open industry standard interconnect for developing an open chiplet ecosystem, where chiplets from any supplier can be packaged anywhere in ...
Abstract: The intermetallic compound CuAl2 is a promising alternative to advanced Cu interconnections because of low electrical resistivity, short electron mean free path, good electromigration ...
Electrum utilizes the 3DEXPERIENCE platform on the cloud to develop their new electric motorcycle Electrum, a new brand of electric motorcycles, utilizes the 3DEXPERIENCE platform. Their mission is to ...
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